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InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced...

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InPsytech Joins Samsung SAFE™ IP Partner Program for Excellence in ONFI and UCIe IP Solutions

InPsytech, a leading provider of advanced silicon intellectual property (IP) solutions, also a member of Egis (6452 TWO) Group, is proud to announce that it has joined the Samsung...

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Media Coverage

InPsytech Unveils 3nm UCIe 3.0 at OCP 2025

InPsytech’s 3 nm UCIe 3.0 demo sets new benchmarks for chiplet interconnect performance and efficiency.

InPsytech, a leading semiconductor IP innovator and subsidiary of Egis Technology, demonstrated its latest 3 nm UCIe 3.0 interface technology at the OCP Global Summit 2025, showcasing advanced chiplet interconnect solutions that promise to accelerate adoption of heterogeneous multi-die systems...

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InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications

InPsytech, Inc., a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, is pleased to announce its participation in the Intel Foundry Accelerator IP Alliance. The collaboration will bring InPsytech's advanced IP offerings to the Intel Foundry ecosystem, enabling mutual customers to design their semiconductor products using Intel Foundry's...

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