Custom Crafted IP
InPsy’s custom-crafted interconnect and memory interface IP eliminates the design complexity by perfectly meeting your requirements – without wasted power, performance, or silicon area. Because InPsy takes full responsibility for the engineering value chain, your team gains the fastest path to design closure, higher design efficiency, and a fast-track route to commercialization. Think of us as your outsourced, in-house IP design team
Die-to-Die & Memory Interface IP Architecture Optimization
InPsy’s architecture team builds IP with your considerations in mind, ensuring each IP block is tuned for bandwidth, latency, clocking, reliability, and power envelopes unique to your product. No generic IP blocks – only right-sized, right-performance architecture built specifically for your product.
Silicon Proven. Production Tested. Customer Validated.
InPsy has delivered silicon proven IP in the most advanced FinFET process nodes across multiple foundries, ensuring your custom crafted IP is ready for the most demanding environments.
Engineered with Generous Performance Margins
Our IPs are built with a margin-rich architecture – from the I/O to the PHY and controller – ensuring robust operation, stable link bring-up, and resilient interoperability across all real-world silicon and system conditions
IP Integration Services
We provide comprehensive integration support, from floor planning and signal-integrity analysis to testability, resilience, and firmware bring-up. Our experts ensure seamless insertion of custom IP into your SoC, multi-die module, or chiplet-based system.
Advanced Packaging Expertise
Whether you are deploying chiplets on a 2.0D organic substrate, 2.5D interposer, 2.5D silicon bridge, or 3D/3.5D vertical stack, InPsytech tunes each IP block for the physical realities of each packaging type.